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The Influence of Cleaning Parameters in High-Density Argon Plasma on the Morphology and Surface Properties of Monocrystalline Silicon Substrates

https://doi.org/10.35596/1729-7648-2026-24-3-44-51

Abstract

The influence of high-density inductively coupled argon plasma parameters on the morphology and surface characteristics of single-crystal silicon substrates was studied. Samples were treated with high-frequency source powers ranging from 100 to 1000 W, with cleaning times of up to 300 s. Surface morphology was analyzed using atomic force microscopy, followed by a study of the contact angle and adhesion work. The effect of high-density plasma cleaning on surface energy was noted. It was found that effective cleaning parameters for achieving minimal roughness and removing contaminants without damaging the surface include a discharge power of 300–500 W and an exposure time of 60–120 s. The obtained data can be used to select plasma cleaning modes for single-crystal silicon substrates in microelectronics processes.

About the Authors

K. Logunov
Belarusian State University of Informatics and Radioelectronics
Belarus

Logunov Konstantin, Postgraduate of Micro- and Nanoelectronics Department, Deputy Dean of the Faculty of Radio Engineering and Electronics

220013, Minsk, P. Brovki St., 6

Теl.: +375 17 293-89-91



A. Mikholap
Belarusian State University of Informatics and Radioelectronics
Belarus

Mikholap А., Student, Belarusian State University of Informatics and Radioelectronics

Minsk



References

1. Bao S. Y., Wang Y., Lina K., Zhang L., Wang B., Sasangka W. A., et al. (2021) A Review of Silicon-Based Wafer Bonding Processes, an Approach to Realize the Monolithic Integration of Si-CMOS and III–V-on-Si Wafers. Journal of Semiconductors. 42 (2), 023–106. https://doi.org/10.1088/1674-4926/42/2/023106.

2. Koichiro S., Takeshi H. (1997) Influence of Silicon-Wafer Loading Ambients in an Oxidation Furnace on the Gate Oxide Degradation Due to Organic Contamination. Applied Physics Letters. 71 (25), 3670–3672.

3. Kim D. K., Park Y. K., Biswas S., Lee C. (2005) Removal Efficiency of Organic Contaminants on Si Wafer Surfaces by the N2O ECR Plasma Technique. Materials Chemistry and Physics. 91 (2), 490–493.

4. Hattori T. (2001) Chemical Contamination Control in ULSI Wafer Processing. AIP Conference Proceedings. 550, 275–284. https://doi.org/10.1063/1.1354411.

5. Bera B. (2019) Silicon Wafer Cleaning: A Fundamental and Critical Step in Semiconductor Fabrication Process. International Journal of Applied Nanotechnology. 5 (1), 8–13.

6. Sammut S. A. (2025) Comprehensive Review of Plasma Cleaning Processes Used in Semiconductor Packaging. Applied Sciences. 15 (13). https://doi.org/10.3390/app15137361.

7. Cheng Y. L., Lee C. Y., Haung C. W. (2019) Plasma Damage on Low-k Dielectric Materials. Plasma Science and Technology. https://doi.org/10.5772/INTECHOPEN.79494.

8. Griffin M., Palgrave R., Baldovino-Medrano V. G., Butler P. E., Kalaskar D. M. (2019) Argon Plasma Improves the Tissue Integration and Angiogenesis of Subcutaneous Implants by Modifying Surface Chemistry and Topography. International Journal of Nanomedicine. 14, 1993–1994. https://doi.org/10.2147/IJN.S206850.

9. Laliotis A., Trupke M., Cotter J. P., Lewis G., Kraft M., Hinds E. A. (2012) ICP Polishing of Silicon for High-Quality Optical Resonators on a Chip. Journal of Micromechanics and Microengineering. 22 (12). https://doi. org/10.1088/0960-1317/ 22/12/125011.

10. Karbowiak T., Debeaufort F., Voilley A. (2006) Importance of Surface Tension Characterization for Food, Pharmaceutical and Packaging Products: A Review. Critical Reviews in Food Science and Nutrition References. 46 (5), 391–407.

11. Hess D. W., Reinhardt A. K. (2018) Plasma Stripping, Cleaning, and Surface Conditioning. Handbook of Silicon Wafer Cleaning Technology. 3rd ed. William Andrew Publishing. 379–455.

12. Nobuya N., Hirotaka T., Yoshinori T., Koji E., Kouich O. (2014) Two Modes of Surface Roughening During Plasma Etching of Silicon: Role of Ionized Etch Products. Journal of Applied Physics. 116, 223–302.

13. Alam A. U., Howlader M., Deen M. J. (2014) The Effects of Oxygen Plasma and Humidity on Surface Roughness, Water Contact Angle and Hardness of Silicon, Silicon Dioxide and Glass. Journal of Micromechanics and Microengineering. 24 (3), 10–35.

14. Lieberman M. A., Lichtenberg A. J. (2005) Principles of Plasma Discharges and Materials Processing. USA, John Wiley and Sons, Inc. Publ.

15. Belford R. E., Sood S. (2007) Surface Activation Using Remote Plasma for Hydrophilic Bonding at Elevated Temperature. Electrochemical and Solid State Letters. 10 (5). DOI: 10.1149/1.2709397.


Review

For citations:


Logunov K., Mikholap A. The Influence of Cleaning Parameters in High-Density Argon Plasma on the Morphology and Surface Properties of Monocrystalline Silicon Substrates. Doklady BGUIR. 2026;24(3):44-51. (In Russ.) https://doi.org/10.35596/1729-7648-2026-24-3-44-51

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ISSN 1729-7648 (Print)
ISSN 2708-0382 (Online)