COMPARATIVE ESTIMATION OF SEMICONDUCTOR DICE MOUNTING ALTERNATE NONDESTRUCTIVE EVALUATION METHODS

Abstract

Conventional method of nondestructive control - laser microinterferometry, which possibilities have been earlier expanded concerning to study “semiconductor chip - substrate” assemblies peculiarity, has given the chance to evaluate these assemblies stability to mechanical, electric and thermal loadings and to predict operational reliability of prefabricated production of electronic technics and microelectronics. Laser microinterferometry has very high sensitivity to undetachable connections continuity infringement of these constructions. The above-stated method reliability and practical expediency have been proved by metrological means. Being based on high sensitivity and making a start from laser microinterferometry metrological proved reliability, reliability of a new developed high-sensitive method - laser photoacoustic introscopy in the field of undetachable connections “delicate” structures discontinuity of the given constructions has been confirmed. The comparative estimation of two aforementioned methods was spent on the basis of the correlation analysis.