For citations:
Pilipenka U.A., Saladukha V.A., Siarheichyk H.A., Shestouski D.U. Impact Produced by Recrystallization of Mechanically Destroyed Layer on Planar Side of Silicon Wafer Upon Electrical Parameters of CMOS Microcircuits. Doklady BGUIR. 2024;22(3):21-27. (In Russ.) https://doi.org/10.35596/1729-7648-2024-22-3-21-27