Loop Thermosiphon for Efficient Cooling of Miniature Heat Sources in Electronics
https://doi.org/10.35596/1729-7648-2025-23-4-63-69
Abstract
The article considers a pulsating loop thermosyphon as the most promising heat-transfer device for coo ling heat-loaded miniature semiconductors, which has minimal evaporator dimensions and demonstrates a heat removal density of more than 120 W/cm2. The main disadvantage of this type of thermosyphons is high thermal resistance. To improve the efficiency of heat transfer, ultra-thin powder capillary structures were studied, which intensify the evaporation process in the evaporator of the loop thermosyphon. It has been shown that the use of a 140 μm thick powder capillary structure made from a fraction of copper powder PMS-N with particle sizes of 63–100 μm to reduces the thermal resistance of a loop thermosyphon by three times and increases the heat flux density to 220 W/cm2. The pulsating loop thermosyphon can be used in efficient cooling systems for server stations, industrial computers, telecommunication equipment, where it is necessary to remove heat from miniature semiconductor components in a limited space of a dense arrangement.
About the Authors
V. A. Aliakhnovich
Powder Metallurgy Institute (PMI)
Russian Federation
Russian Federation
Aliakhnovich Valery Adamovich, Senior Researcher at the R&D La boratory of Capillary-Porous Materials (Lab. 24)
Тel.: +375 17 290-99-92
220005, Republic of Belarus, Minsk, Platonova St., 41
A. Ph. Ilyushchanka
Powder Metallurgy Institute (PMI)
Russian Federation
Russian Federation
Academician of the National Academy of Sciences of Belarus, Dr. Sci. (Tech.), Professor, Director
Minsk
P. S. Ancheuski
Powder Metallurgy Institute
Belarus
Belarus
Head of the Lab. 24, PMI
Minsk
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Review
For citations:
Aliakhnovich V.A., Ilyushchanka A.P., Ancheuski P.S. Loop Thermosiphon for Efficient Cooling of Miniature Heat Sources in Electronics. Doklady BGUIR. 2025;23(4):63-69. (In Russ.) https://doi.org/10.35596/1729-7648-2025-23-4-63-69
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