Modeling of Thermal Fields in Induction Heating with Eddy Current Concentrators
https://doi.org/10.35596/1729-7648-2025-23-4-14-20
Abstract
A three-dimensional nonlinear mathematical model of induction heating for forming ball terminals using the Flip-Chip technology has been developed. The study was conducted at frequencies of 300, 732, and 900 kHz with a heating power of 20–100 W. The use of a ferrite core focusing the magnetic field and an eddy current concentrator allowed us to establish optimal thermal profiles for forming ball terminals for mounting integrated circuits with a heating rate of 2.0 to 5.5 °C/s. When analyzing the results obtained from the experiments, the option of locating the concentrator at the bottom of the board turned out to be optimal. In this case, heating the solder balls at the selected frequencies reached the melting temperature of the ball terminals of 230–250 °C, which is sufficient for their reflow.
About the Authors
A. D. Khatskevich
Belarusian State University of Informatics and Radioelectronics
Belarus
Belarus
Khatskevich Aleksandr Dmitrievich, Researcher, M. of Sci. (Tech.), Assistant at the Department of Electronic Engineering and Technology
220013, Minsk, P. Brovki St., 6
Tel.: +375 29 652-50-30
V. L. Lanin
Belarusian State University of Informatics and Radioelectronics
Belarus
Belarus
Dr. Sci. (Tech.), Professor at the Department of Electronic Engineering and Technology
Minsk
References
1. Baker J., Smith R., Johnson P. (2021) Advances in Induction Heating for Electronics Assembly. Journal of Microelectronics Manufacturing. 34 (3), 123–134.
2. Kim Y., Lee H., Park S. (2020) Thermal Management in Flip Chip Bonding: Challenges and Solutions. IEEE Transactions on Advanced Packaging. 43 (5), 789–798.
3. Xu L., Zhang W., Chen Q. (2019) Innovations in Flip Chip Soldering Technologies. Microelectronics International. 36 (4), 245–257.
4. Hongbo Xu, Mingyu Li, Yonggao Fu, Ling Wang, Jongmyung Kim (2009) Local Melt Process of Solder Bamping by Induction Heating Reflow. Soldering and Surface Mount Technology. 25 (4), 45–54.
Review
For citations:
Khatskevich A.D., Lanin V.L. Modeling of Thermal Fields in Induction Heating with Eddy Current Concentrators. Doklady BGUIR. 2025;23(4):14-20. (In Russ.) https://doi.org/10.35596/1729-7648-2025-23-4-14-20
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