Preview

Doklady BGUIR

Advanced search

The impact of formation modes of platinum silicide by the quick heat treatment on Schottky diodes parameters

Abstract

The results of studying of the impact of formation modes of platinum silicide using qiuck heat treatment on electrophysical parameters of Schottky diodes are presented. It is shown that this treatment, as compared to the traditional one, allows at the cost of reducing of microrelief of boundary of PtSi–Si, and also obtaining as a result of treatment a less defective and equilibrium structure of the barrier layer, to raise barrier height from 0,804 to 0,825 V, to reduce leakage current from –4,42·10-6 to –2,85·10-6 A and in 1,25 times and to raise the reliability of Schottky diodes at operating temperature 125 °C.

About the Authors

V. A. Saladukha
JSC «INTEGRAL» – holding managing company «INTEGRAL»
Belarus
PhD, general manager


V. A. Pilipenko
JSC «INTEGRAL» – holding managing company «INTEGRAL»
Belarus

Pilipenka Uladzimir Aleksandrovich - D.Sci, professor, corresponding member of the National academy of sciences of Belarus, deputy director of science development of state center «Belmicroanalysis»

220108, Minsk, Kazintsa st., 121A

tel. +375-17-212-37-41



V. A. Gorushko
JSC «INTEGRAL» – holding managing company «INTEGRAL»
Belarus
leading engineer of state center «Belmicroanalysis»


V. A. Philipenya
JSC «INTEGRAL» – holding managing company «INTEGRAL»
Belarus
leading engineer of state center «Belmicroanalysis»


References

1. Roderick E.Kh. Metal-semiconductor contacts. М.: Radio and communication, 1982. 216 p.

2. Strikha V.I., Buzaneva Е.V. Physical basis of the reliability of metal-semiconductor contacts in integrated electronics. М.: Radion and communication, 1987. 256 p.

3. VLSI Technology / Ed. by S.М. Zi. Vol. 2. М.: Мir, 1986. 453 p.

4. Мiurarka Sh.P. Silicides for VLSI. М.: Мir, 1986. 176 p.

5. Low-temperature formation method of contact layer of platinum silicide for high-power Schottky diodes / F.F. Коmarov [et al.] // Reports of Belarus National Academy of Sciences. 2013. Т. 53, No. 2. P. 38–42.

6. Two-step low temperature annealing for the Nickel-Platinum compound silicide formation for high-power Schottky diodes / V. Saladukha [et al.] // IX International Conference «Ion Implantation and Other Application of Ions and Electrons». Poland, Kazimierz Dolny, 25–28 June 2012. P. 99–100.

7. The formation of silicides by pulse heat treatment of film structures / V.А. Labunov [et al.] // Foreign electronic technique. 1985. No. 8. P. 27–53.

8. Pilipenko V.А., Ponomar V.N., Gorushko V.А. Properties controlling of thin-film systems using pulse photon treatment // Engineering-physical journal. 2003. Vol. 76, No. 4. P. 95–98.

9. Singh R., Nulman J. Development trends in the direction of rapid isothremal processing (RIP) dominated silicon integrated circuit fabrication // Material research society. 1991. P. 441–448.

10. Standart 11 050.003-83. Gases used in the manufacture of Electronics Articles. Technical requirements and control methods.


Review

For citations:


Saladukha V.A., Pilipenko V.A., Gorushko V.A., Philipenya V.A. The impact of formation modes of platinum silicide by the quick heat treatment on Schottky diodes parameters. Doklady BGUIR. 2019;(1):62-67. (In Russ.)

Views: 425


Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.


ISSN 1729-7648 (Print)
ISSN 2708-0382 (Online)