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<article article-type="research-article" dtd-version="1.3" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xml:lang="ru"><front><journal-meta><journal-id journal-id-type="publisher-id">bsuir</journal-id><journal-title-group><journal-title xml:lang="ru">Доклады БГУИР</journal-title><trans-title-group xml:lang="en"><trans-title>Doklady BGUIR</trans-title></trans-title-group></journal-title-group><issn pub-type="ppub">1729-7648</issn><issn pub-type="epub">2708-0382</issn><publisher><publisher-name>БГУИР</publisher-name></publisher></journal-meta><article-meta><article-id pub-id-type="doi">10.35596/1729-7648-2026-24-3-14-20</article-id><article-id custom-type="elpub" pub-id-type="custom">bsuir-4370</article-id><article-categories><subj-group subj-group-type="heading"><subject>Research Article</subject></subj-group><subj-group subj-group-type="section-heading" xml:lang="ru"><subject>Статьи</subject></subj-group></article-categories><title-group><article-title>Электрофизические характеристики сенсоров температуры и влажности на основе углеродсодержащего PLA-пластика</article-title><trans-title-group xml:lang="en"><trans-title>Electrophysical Characteristics of Temperature and Humidity Sensors Based on Carbon-Containing PLA Plastic</trans-title></trans-title-group></title-group><contrib-group><contrib contrib-type="author" corresp="yes"><name-alternatives><name name-style="eastern" xml:lang="ru"><surname>Лобанок</surname><given-names>М. В.</given-names></name><name name-style="western" xml:lang="en"><surname>Lobanok</surname><given-names>M.</given-names></name></name-alternatives><bio xml:lang="ru"><p>Лобанок Михаил Владимирович, канд. физ.-мат. наук, доц. каф. физической электроники и нанотехнологий</p><p>220064, Минск, ул. Курчатова, 5</p><p>Тел.: +375 29 654-09-53</p></bio><bio xml:lang="en"><p>Lobanok Mikhail, Cand. Sci. (Phys. and Math.), Associate Professor of the Department of Physical Electronics and Nanotechnologies</p><p>220064, Minsk, Kurchatova St., 5</p><p>Tel.: +375 29 654-09-53</p></bio><email xlink:type="simple">LobanokMV@bsu.by</email><xref ref-type="aff" rid="aff-1"/></contrib><contrib contrib-type="author" corresp="yes"><name-alternatives><name name-style="eastern" xml:lang="ru"><surname>Чижов</surname><given-names>И. В.</given-names></name><name name-style="western" xml:lang="en"><surname>Chizhov</surname><given-names>I.</given-names></name></name-alternatives><bio xml:lang="ru"><p>Чижов И. В., асп. каф. физической электроники и нанотехнологий</p><p>Минск</p></bio><bio xml:lang="en"><p>Chizhov I., Postgraduate of Physical Electronics and Nanotechnologies Department</p><p>Minsk</p></bio><xref ref-type="aff" rid="aff-1"/></contrib><contrib contrib-type="author" corresp="yes"><name-alternatives><name name-style="eastern" xml:lang="ru"><surname>Павлышко</surname><given-names>М. А.</given-names></name><name name-style="western" xml:lang="en"><surname>Paulyshka</surname><given-names>M.</given-names></name></name-alternatives><bio xml:lang="ru"><p>Павлышко М. А., науч. сотр. НИЛ информационно-измерительных систем</p><p>Минск</p></bio><bio xml:lang="en"><p>Paulyshka M., Researcher at the Research Laboratory of Information and Measuring Systems</p><p>Minsk</p></bio><xref ref-type="aff" rid="aff-1"/></contrib><contrib contrib-type="author" corresp="yes"><name-alternatives><name name-style="eastern" xml:lang="ru"><surname>Потоцкий</surname><given-names>А. С.</given-names></name><name name-style="western" xml:lang="en"><surname>Pototsky</surname><given-names>A.</given-names></name></name-alternatives><bio xml:lang="ru"><p>Потоцкий А. С., студент</p><p>Минск</p></bio><bio xml:lang="en"><p>Pototsky A., Student</p><p>Minsk</p></bio><xref ref-type="aff" rid="aff-1"/></contrib></contrib-group><aff-alternatives id="aff-1"><aff xml:lang="ru"><institution>Белорусский государственный университет</institution></aff><aff xml:lang="en"><institution>Belarusian State University</institution></aff></aff-alternatives><pub-date pub-type="collection"><year>2026</year></pub-date><pub-date pub-type="epub"><day>29</day><month>06</month><year>2026</year></pub-date><volume>24</volume><issue>3</issue><fpage>14</fpage><lpage>20</lpage><permissions><copyright-statement>Copyright &amp;#x00A9; Лобанок М.В., Чижов И.В., Павлышко М.А., Потоцкий А.С., 2026</copyright-statement><copyright-year>2026</copyright-year><copyright-holder xml:lang="ru">Лобанок М.В., Чижов И.В., Павлышко М.А., Потоцкий А.С.</copyright-holder><copyright-holder xml:lang="en">Lobanok M., Chizhov I., Paulyshka M., Pototsky A.</copyright-holder><license xml:lang="ru" license-type="creative-commons-attribution" xlink:href="https://creativecommons.org/licenses/by/4.0/" xlink:type="simple"><license-p>Данная работа распространяется под лицензией Creative Commons Attribution 4.0.</license-p></license><license xml:lang="en" license-type="creative-commons-attribution" xlink:href="https://creativecommons.org/licenses/by/4.0/" xlink:type="simple"><license-p>This work is licensed under a Creative Commons Attribution 4.0 License.</license-p></license></permissions><self-uri xlink:href="https://doklady.bsuir.by/jour/article/view/4370">https://doklady.bsuir.by/jour/article/view/4370</self-uri><abstract><p>Исследованы электрофизические характеристики 3D-печатных сенсоров температуры и влажности на основе проводящего PLA-композита с углеродным наполнителем. Установлены связи между морфологией структуры, полученной методом послойного наплавления расплавом, топологией токопроводящих дорожек и частотно-зависимым откликом при изменении температуры и относительной влажности. Показано, что экструзия через сопло и послойное формирование дорожки увеличивают удельное сопротивление одиночного трека в 3–4 раза по сравнению с исходной нитью вследствие межслоевых границ, пористости и частичной перестройки перколяционной сети. Отмечено, что последовательная топология обеспечивает наибольший относительный отклик, тогда как параллельная – минимальное базовое сопротивление. В диапазоне 20–100 °C наблюдается отрицательный температурный коэффициент сопротивления, а при изменении влажности от 40 до 100 % характер сигнала зависит от частоты измерения. Показано, что в области низких и средних частот сопротивление изменяется слабо и преимущественно определяется барьерно-перколяционным переносом, тогда как при 100 кГц может проявляться слабый вклад межфазной поляризации и емкостного шунтирования.</p></abstract><trans-abstract xml:lang="en"><p>The electrophysical characteristics of 3D-printed temperature and humidity sensors based on a conductive PLA composite with carbon filler are studied. Relationships are established between the morphology of the structure obtained by fused deposition, the topology of the conductive tracks, and the frequency-dependent response to changes in temperature and relative humidity. It is shown that extrusion through a nozzle and layer-by-layer track formation increase the specific resistance of a single track by 3–4 times compared to the original filament due to interlayer boundaries, porosity, and partial rearrangement of the percolation network. It is noted that the serial topology provides the highest relative response, while the parallel topology provides the lowest baseline resistance. A negative temperature coefficient of resistance is observed in the range of 20–100 °C, and as the humidity changes from 40 to 100 %, the nature of the signal depends on the measurement frequency. It is shown that in the low and medium frequency region the resistance changes weakly and is mainly determined by barrier percolation transport, whereas at 100 kHz a weak contribution of interfacial polarization and capacitive shunting can appear.</p></trans-abstract><kwd-group xml:lang="ru"><kwd>3D-печать</kwd><kwd>метод послойного наплавления расплавом</kwd><kwd>сенсор влажности</kwd><kwd>сенсор температуры</kwd><kwd>проводящий полилактид</kwd><kwd>перколяционный композит</kwd><kwd>углеродный наполнитель</kwd></kwd-group><kwd-group xml:lang="en"><kwd>3D printing</kwd><kwd>fused deposition modeling</kwd><kwd>humidity sensor</kwd><kwd>temperature sensor</kwd><kwd>conductive polylactide</kwd><kwd>percolation composite</kwd><kwd>carbon filler</kwd></kwd-group></article-meta></front><back><ref-list><title>References</title><ref id="cit1"><label>1</label><citation-alternatives><mixed-citation xml:lang="ru">Ahmed F., Azhari A., Marzbanrad E., Liravi F., Ali U., Pope M. A., et al. 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