<?xml version="1.0" encoding="UTF-8"?>
<!DOCTYPE article PUBLIC "-//NLM//DTD JATS (Z39.96) Journal Publishing DTD v1.3 20210610//EN" "JATS-journalpublishing1-3.dtd">
<article article-type="research-article" dtd-version="1.3" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xml:lang="ru"><front><journal-meta><journal-id journal-id-type="publisher-id">bsuir</journal-id><journal-title-group><journal-title xml:lang="ru">Доклады БГУИР</journal-title><trans-title-group xml:lang="en"><trans-title>Doklady BGUIR</trans-title></trans-title-group></journal-title-group><issn pub-type="ppub">1729-7648</issn><issn pub-type="epub">2708-0382</issn><publisher><publisher-name>БГУИР</publisher-name></publisher></journal-meta><article-meta><article-id pub-id-type="doi">10.35596/1729-7648-2022-20-7-12-19</article-id><article-id custom-type="elpub" pub-id-type="custom">bsuir-3495</article-id><article-categories><subj-group subj-group-type="heading"><subject>Research Article</subject></subj-group><subj-group subj-group-type="section-heading" xml:lang="ru"><subject>ЭЛЕКТРОНИКА, РАДИОФИЗИКА, РАДИОТЕХНИКА, ИНФОРМАТИКА</subject></subj-group><subj-group subj-group-type="section-heading" xml:lang="en"><subject>ELECTRONICS, RADIOPHYSICS, RADIOENGINEERING, INFORMATICS</subject></subj-group></article-categories><title-group><article-title>Использование лазерной интерферометрии для определения времени окончания плазмохимического травления слоев p-GaN и AlGaN гетероструктуры p-GaN/AlGaN/GaN с двумерным электронным газом</article-title><trans-title-group xml:lang="en"><trans-title>Use of Laser Interferometry to Determine the End Time of the Plasma-Chemical Etching of p-GaN and AlGaN Layers of the p-GaN/AlGaN/GaN Heterostructure with Two-Dimensional Electron Gas</trans-title></trans-title-group></title-group><contrib-group><contrib contrib-type="author" corresp="yes"><name-alternatives><name name-style="eastern" xml:lang="ru"><surname>Юник</surname><given-names>А. Д.</given-names></name><name name-style="western" xml:lang="en"><surname>Yunik</surname><given-names>A. D.</given-names></name></name-alternatives><bio xml:lang="ru"><p>Юник Андрей Дмитриевич - ведущий инженер отраслевойлаборатории новых технологий и материалов </p><p>220108, Республика Беларусь, г. Минск, ул. Корженевского, 16, к. 247Тел. +375 29 854-66-51</p></bio><bio xml:lang="en"><p>Yunik Andrei Dmitrievich, Leading Engineer of the Branch Laboratory of New Technologies and Materials </p><p>220108, Republic of Belarus, Minsk, Korzhenevskogo St., 16, r. 247Tel. +375 29 854-66-51</p></bio><email xlink:type="simple">a.unik.gan@gmail.com</email><xref ref-type="aff" rid="aff-1"/></contrib><contrib contrib-type="author" corresp="yes"><name-alternatives><name name-style="eastern" xml:lang="ru"><surname>Шидловский</surname><given-names>А. Г.</given-names></name><name name-style="western" xml:lang="en"><surname>Shydlouski</surname><given-names>A. H.</given-names></name></name-alternatives><bio xml:lang="ru"><p>Шидловский А. Г., ведущий инженер-технолог отраслевой лаборатории новых технологий и материалов</p><p>Минск </p></bio><bio xml:lang="en"><p> Shydlouski A. H., Leading Process Engineer of the Branch Laboratory of New Technologies and Materials </p><p> Minsk </p></bio><xref ref-type="aff" rid="aff-1"/></contrib></contrib-group><aff-alternatives id="aff-1"><aff xml:lang="ru"><institution>ОАО «ИНТЕГРАЛ» – управляющая компания холдинга «ИНТЕГРАЛ»</institution></aff><aff xml:lang="en"><institution>JSC “INTEGRAL” – “INTEGRAL” Holding Managing Company</institution></aff></aff-alternatives><pub-date pub-type="collection"><year>2022</year></pub-date><pub-date pub-type="epub"><day>09</day><month>12</month><year>2022</year></pub-date><volume>20</volume><issue>7</issue><fpage>12</fpage><lpage>19</lpage><permissions><copyright-statement>Copyright &amp;#x00A9; Юник А.Д., Шидловский А.Г., 2022</copyright-statement><copyright-year>2022</copyright-year><copyright-holder xml:lang="ru">Юник А.Д., Шидловский А.Г.</copyright-holder><copyright-holder xml:lang="en">Yunik A.D., Shydlouski A.H.</copyright-holder><license xml:lang="ru" license-type="creative-commons-attribution" xlink:href="https://creativecommons.org/licenses/by/4.0/" xlink:type="simple"><license-p>Данная работа распространяется под лицензией Creative Commons Attribution 4.0.</license-p></license><license xml:lang="en" license-type="creative-commons-attribution" xlink:href="https://creativecommons.org/licenses/by/4.0/" xlink:type="simple"><license-p>This work is licensed under a Creative Commons Attribution 4.0 License.</license-p></license></permissions><self-uri xlink:href="https://doklady.bsuir.by/jour/article/view/3495">https://doklady.bsuir.by/jour/article/view/3495</self-uri><abstract><p>Методом лазерной интерферометрии и сканирующей электронной микроскопии установлены закономерности изменения во времени интенсивности отраженного сигнала, регистрируемого детектором лазерного интерферометра с рабочей частотой 670 нм в процессе реактивного ионного травления в индуктивно-связанной плазме в атмосфере Cl2/N2/O2 слоев GaN, p-GaN и AlGaN в гетероструктурах типов AlGaN/GaN и p-GaN/AlGaN/GaN, обусловленные изменениями их показателей преломления и скоростей травления. При реактивном ионном травлении в индуктивносвязанной плазме слоев GaN и p-GaN интенсивности отраженного сигнала изменяются по периодическому закону с периодом изменения толщины порядка 144 нм, а для слоев типа AlGaN – порядка 148 нм, что обусловлено различиями их показателей преломления и скоростей травления. При переходе границы раздела p-GaN/AlGaN и AlGaN/GaN наблюдается скачкообразное изменение интенсивности отраженного сигнала в пределах 2,7–9,5 % в течение 20–40 с, обусловленное изменениями концентрации алюминия, показателей преломления и скорости травления на границах раздела. Изменение периодичности интерферограммы, сопровождающееся скачком интенсивности при переходе фронта травления через границу раздела p-GaN/AlGaN и AlGaN/GaN, позволяет с помощью лазерной интерферометрии в реальном масштабе времени определять время окончания процесса реактивного ионного травления в индуктивно-связанной плазме слоев AlGaN и p-GaN в гетероструктурах типов AlGaN/GaN и p-GaN/AlGaN/GaN с двумерным электронным газом. Полученные результаты могут быть использованы для формирования элементов устройств СВЧ и силовой электроники на основе гетероструктур типа AlGaN/GaN.</p></abstract><trans-abstract xml:lang="en"><p>Regularities of the reflected signal intensity changing in time, recorded by the detector of the laser interferometer with the operating frequency of 670 nm during the inductively coupled plasma reactive ion etching in a Cl2/N2/O2 atmosphere of GaN, p-GaN and AlGaN in AlGaN/GaN and p-GaN/AlGaN/GaN heterostructures has been established by laser interferometry and scanning electron microscopy methods due to the changes in refractive indices and etching rates. During inductively coupled plasma reactive ion etching of GaN and p-GaN layers, the intensity of the reflected signal changes according to a periodic law with the thickness change period of about 144 nm, and for AlGaN layers about 148 nm, which is due to differences in their refractive indices and etching rates. During the crossing of the p-GaN/AlGaN and AlGaN/GaN interface, there is an abrupt change in the intensity of the reflected signal within 2.7–9.5 % for 20–40 s, due to changes in the aluminum concentration, refractive indices, and etching rate at the interfaces. The change in the periodicity of the interferogram, which is accompanied by a jump in intensity when passing through the etching front through the p-GaN/AlGaN and AlGaN/GaN interface, makes it possible to determine the end time of the inductively coupled plasma reactive ion etching of the AlGaN and p-GaN layers using laser interferometry in real time in AlGaN/GaN and p-GaN/AlGaN/GaN heterostructures with two-dimensional electron gas. The obtained results can be used to form microwave and power electronics devices elements which are based on the AlGaN/GaN heterostructures.</p></trans-abstract><kwd-group xml:lang="ru"><kwd>плазмохимическое травление</kwd><kwd>индуктивно-связанная плазма</kwd><kwd>лазерный интерферометр</kwd><kwd>нитрид галлия</kwd><kwd>гетероструктура</kwd><kwd>транзистор с высокой подвижностью электронов</kwd></kwd-group><kwd-group xml:lang="en"><kwd>plasma-chemical etching</kwd><kwd>inductively coupled plasma</kwd><kwd>laser interferometer</kwd><kwd>gallium nitride</kwd><kwd>heterostructure</kwd><kwd>high electron mobility transistor</kwd></kwd-group></article-meta></front><back><ref-list><title>References</title><ref id="cit1"><label>1</label><citation-alternatives><mixed-citation xml:lang="ru">Alex Lidow, Michael de Rooij, Johan Strydom, David Reusch, John Glaser (2020) GaN Transistors for Efficient Power Conversion, 3rd ed. Hoboken. NJ, John Wiley &amp; Sons, Inc., 384.</mixed-citation><mixed-citation xml:lang="en">Alex Lidow, Michael de Rooij, Johan Strydom, David Reusch, John Glaser (2020) GaN Transistors for Efficient Power Conversion, 3rd ed. Hoboken. NJ, John Wiley &amp; Sons, Inc., 384.</mixed-citation></citation-alternatives></ref><ref id="cit2"><label>2</label><citation-alternatives><mixed-citation xml:lang="ru">Rüdiger Quay (2008) Gallium Nitride Electronics. Springer Series in Materials Science. Springer Berlin, Heidelberg, 470. DOI:10.1007/978-3-540-71892-5.</mixed-citation><mixed-citation xml:lang="en">Rüdiger Quay (2008) Gallium Nitride Electronics. Springer Series in Materials Science. Springer Berlin, Heidelberg, 470. DOI:10.1007/978-3-540-71892-5.</mixed-citation></citation-alternatives></ref><ref id="cit3"><label>3</label><citation-alternatives><mixed-citation xml:lang="ru">Zhou Y., Zhong Y., Gao H., Dai S., He J., Feng M., Zhao Y., Sun Q., Dingsun A., Yang H. (2017) p-GaN Gate Enhancement-Mode HEMT Through a High Tolerance Self-Terminated Etching Process. IEEE J. Electron Devices Soc. 5 (5), 340–346. DOI:10.1109/JEDS.2017.2725320.</mixed-citation><mixed-citation xml:lang="en">Zhou Y., Zhong Y., Gao H., Dai S., He J., Feng M., Zhao Y., Sun Q., Dingsun A., Yang H. (2017) p-GaN Gate Enhancement-Mode HEMT Through a High Tolerance Self-Terminated Etching Process. IEEE J. Electron Devices Soc. 5 (5), 340–346. DOI:10.1109/JEDS.2017.2725320.</mixed-citation></citation-alternatives></ref><ref id="cit4"><label>4</label><citation-alternatives><mixed-citation xml:lang="ru">Yunik A. D., Solovjov Ja. А., Zhyhulin D. V. (2022) Effect of Rapid Thermal Annealing Temperature on the Electrophysical Properties of the Ohmic Contact of Ti/Al/Ni Metallization to the GaN/AlGaN Heterostructure. Doklady BGUIR. 20 (3), 13–19. DOI: 10.35596/1729-7648-2022-20-3-13-19 (in Russian).</mixed-citation><mixed-citation xml:lang="en">Yunik A. D., Solovjov Ja. А., Zhyhulin D. V. (2022) Effect of Rapid Thermal Annealing Temperature on the Electrophysical Properties of the Ohmic Contact of Ti/Al/Ni Metallization to the GaN/AlGaN Heterostructure. Doklady BGUIR. 20 (3), 13–19. DOI: 10.35596/1729-7648-2022-20-3-13-19 (in Russian).</mixed-citation></citation-alternatives></ref><ref id="cit5"><label>5</label><citation-alternatives><mixed-citation xml:lang="ru">Han Y., Xue S., Guo W., Luo Y., Hao Z., Sun C. (2003) Highly Selective Dry Etching of GaN over AlGaN Using Inductively Coupled Cl2/N2/O2 Plasmas. Jpn. J. Appl. Phys. (42), L1139–L1141. DOI: 10.1143/JJAP.42.L1139.</mixed-citation><mixed-citation xml:lang="en">Han Y., Xue S., Guo W., Luo Y., Hao Z., Sun C. (2003) Highly Selective Dry Etching of GaN over AlGaN Using Inductively Coupled Cl2/N2/O2 Plasmas. Jpn. J. Appl. Phys. (42), L1139–L1141. DOI: 10.1143/JJAP.42.L1139.</mixed-citation></citation-alternatives></ref><ref id="cit6"><label>6</label><citation-alternatives><mixed-citation xml:lang="ru">Greco G., Iucolano F., Roccaforte F. (2018) Review of Technology for Normally-Off HEMTs with p-GaN Gate. Mater. Sci. Semicond. Process. (78), 96–106. DOI: 10.1016/j.mssp.2017.09.027.</mixed-citation><mixed-citation xml:lang="en">Greco G., Iucolano F., Roccaforte F. (2018) Review of Technology for Normally-Off HEMTs with p-GaN Gate. Mater. Sci. Semicond. Process. (78), 96–106. DOI: 10.1016/j.mssp.2017.09.027.</mixed-citation></citation-alternatives></ref><ref id="cit7"><label>7</label><citation-alternatives><mixed-citation xml:lang="ru">Yoshio Nishi, Robert Doering (2007) Handbook of Semiconductor Manufacturing Technology, 2nd ed. CRC Press. 1720.</mixed-citation><mixed-citation xml:lang="en">Yoshio Nishi, Robert Doering (2007) Handbook of Semiconductor Manufacturing Technology, 2nd ed. CRC Press. 1720.</mixed-citation></citation-alternatives></ref><ref id="cit8"><label>8</label><citation-alternatives><mixed-citation xml:lang="ru">Noh H.-T., Kim D.-I., Han S.-S. (2015) Real Time Endpoint Detection in Plasma Etching Using Real-Time Decision Making Algorithm. China Semiconductor Technology International Conference. DOI: 10.1109/cstic.2015.7153380.</mixed-citation><mixed-citation xml:lang="en">Noh H.-T., Kim D.-I., Han S.-S. (2015) Real Time Endpoint Detection in Plasma Etching Using Real-Time Decision Making Algorithm. China Semiconductor Technology International Conference. DOI: 10.1109/cstic.2015.7153380.</mixed-citation></citation-alternatives></ref><ref id="cit9"><label>9</label><citation-alternatives><mixed-citation xml:lang="ru">Azzam R. M. A., Bashara N. M. (1988) Ellipsometry and Polarized Light, 3rd reprint 1999 ed. North-Holland Personal Library. 558.</mixed-citation><mixed-citation xml:lang="en">Azzam R. M. A., Bashara N. M. (1988) Ellipsometry and Polarized Light, 3rd reprint 1999 ed. North-Holland Personal Library. 558.</mixed-citation></citation-alternatives></ref><ref id="cit10"><label>10</label><citation-alternatives><mixed-citation xml:lang="ru">Brunner D., Angerer H., Bustarret E., Freudenberg F., Höpler R., Dimitrov R., Ambacher O., Stutzmann M. (1997) Optical Constants of Epitaxial AlGaN Films and their Temperature Dependence. Journal of Applied Physics. 82 (10), 5090–5096. DOI: 10.1063/1.366309.</mixed-citation><mixed-citation xml:lang="en">Brunner D., Angerer H., Bustarret E., Freudenberg F., Höpler R., Dimitrov R., Ambacher O., Stutzmann M. (1997) Optical Constants of Epitaxial AlGaN Films and their Temperature Dependence. Journal of Applied Physics. 82 (10), 5090–5096. DOI: 10.1063/1.366309.</mixed-citation></citation-alternatives></ref></ref-list><fn-group><fn fn-type="conflict"><p>The authors declare that there are no conflicts of interest present.</p></fn></fn-group></back></article>
