<?xml version="1.0" encoding="UTF-8"?>
<!DOCTYPE article PUBLIC "-//NLM//DTD JATS (Z39.96) Journal Publishing DTD v1.3 20210610//EN" "JATS-journalpublishing1-3.dtd">
<article article-type="research-article" dtd-version="1.3" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xml:lang="ru"><front><journal-meta><journal-id journal-id-type="publisher-id">bsuir</journal-id><journal-title-group><journal-title xml:lang="ru">Доклады БГУИР</journal-title><trans-title-group xml:lang="en"><trans-title>Doklady BGUIR</trans-title></trans-title-group></journal-title-group><issn pub-type="ppub">1729-7648</issn><issn pub-type="epub">2708-0382</issn><publisher><publisher-name>БГУИР</publisher-name></publisher></journal-meta><article-meta><article-id custom-type="elpub" pub-id-type="custom">bsuir-229</article-id><article-categories><subj-group subj-group-type="heading"><subject>Research Article</subject></subj-group><subj-group subj-group-type="section-heading" xml:lang="ru"><subject>Статьи</subject></subj-group></article-categories><title-group><article-title>КАЛИБРОВКА СИСТЕМЫ, ПРЕДНАЗНАЧЕННОЙ ДЛЯ КОНТРОЛЯ ПРОВОДНИКОВ НА ПОДЛОЖКЕ МИКРОСХЕМЫ</article-title><trans-title-group xml:lang="en"><trans-title>CALIBRATION OF THE SYSTEM USED FOR CONDUCTOR INSPECTION AT MICROCHIP SUBSTRATE</trans-title></trans-title-group></title-group><contrib-group><contrib contrib-type="author" corresp="yes"><name-alternatives><name name-style="eastern" xml:lang="ru"><surname>Губчик</surname><given-names>И. Н.</given-names></name><name name-style="western" xml:lang="en"><surname>Gubchik</surname><given-names>I. N.</given-names></name></name-alternatives><email xlink:type="simple">noemail@neicon.ru</email><xref ref-type="aff" rid="aff-1"/></contrib></contrib-group><aff xml:lang="ru" id="aff-1"><institution>Белорусский государственный университет информатики и радиоэлектроники</institution><country>Belarus</country></aff><pub-date pub-type="collection"><year>2013</year></pub-date><pub-date pub-type="epub"><day>03</day><month>06</month><year>2019</year></pub-date><volume>0</volume><issue>6</issue><fpage>92</fpage><lpage>97</lpage><permissions><copyright-statement>Copyright &amp;#x00A9; Губчик И.Н., 2019</copyright-statement><copyright-year>2019</copyright-year><copyright-holder xml:lang="ru">Губчик И.Н.</copyright-holder><copyright-holder xml:lang="en">Gubchik I.N.</copyright-holder><license xml:lang="ru" license-type="creative-commons-attribution" xlink:href="https://creativecommons.org/licenses/by/4.0/" xlink:type="simple"><license-p>Данная работа распространяется под лицензией Creative Commons Attribution 4.0.</license-p></license><license xml:lang="en" license-type="creative-commons-attribution" xlink:href="https://creativecommons.org/licenses/by/4.0/" xlink:type="simple"><license-p>This work is licensed under a Creative Commons Attribution 4.0 License.</license-p></license></permissions><self-uri xlink:href="https://doklady.bsuir.by/jour/article/view/229">https://doklady.bsuir.by/jour/article/view/229</self-uri><abstract><p>Описывается методика калибровки фотометрической системы для решения конкретной задачи оценки положения проводника, соединяющего полупроводниковую микросхему с подложкой. Строится нелинейная модель дисторсии объектива камеры, позволяющая оценить положение проводника в трехмерном пространстве с заданной точностью. Новизна описанной методики заключается в обеспечении поставленной точности измерений параметров проводника с высокой скоростью обработки.</p></abstract><trans-abstract xml:lang="en"><p>The article describes the calibration method of the photometric system for a particular purpose of estimation position of the conductor connecting the semiconductor chip and the substrate. A nonlinear model of the camera lens distortion, which allows estimating the position of the conductor in a three-dimensional space with the required accuracy is described. The novelty of the described technique is to provide the required accuracy of conductor parameters measurement with a high processing speed.</p></trans-abstract><kwd-group xml:lang="ru"><kwd>калибровка камеры</kwd><kwd>точность калибровки</kwd><kwd>трехмерная сцена</kwd></kwd-group></article-meta></front><back><ref-list><title>References</title><ref id="cit1"><label>1</label><citation-alternatives><mixed-citation xml:lang="ru">Salvi J., Armangue X., Batlle J. // Pattern Recognition. 2002. Vol. 35, Iss. 7. P. 1617-1635.</mixed-citation><mixed-citation xml:lang="en">Salvi J., Armangue X., Batlle J. // Pattern Recognition. 2002. Vol. 35, Iss. 7. P. 1617-1635.</mixed-citation></citation-alternatives></ref><ref id="cit2"><label>2</label><citation-alternatives><mixed-citation xml:lang="ru">Gupta M., Upadhyay S., Singh S. et. al. // International Journal of Enterprise Computing and Business Systems. 2011. Vol. 1, Iss. 2.</mixed-citation><mixed-citation xml:lang="en">Gupta M., Upadhyay S., Singh S. et. al. // International Journal of Enterprise Computing and Business Systems. 2011. Vol. 1, Iss. 2.</mixed-citation></citation-alternatives></ref><ref id="cit3"><label>3</label><citation-alternatives><mixed-citation xml:lang="ru">Ankur D., Jun-Sik K., Kanade T. // IEEE 12th International Conference on Computer Vision Workshops. 2009 Р. 1201-1208.</mixed-citation><mixed-citation xml:lang="en">Ankur D., Jun-Sik K., Kanade T. // IEEE 12th International Conference on Computer Vision Workshops. 2009 Р. 1201-1208.</mixed-citation></citation-alternatives></ref><ref id="cit4"><label>4</label><citation-alternatives><mixed-citation xml:lang="ru">Semiconductors history review [Электронный ресурс]. - Режим доступа: http://www.pwc.com/en_GX/gx/technology/publications/assets/semiconductor-industry-analysis-and-projections.pdf - Дата доступа: 28.02.2013</mixed-citation><mixed-citation xml:lang="en">Semiconductors history review [Электронный ресурс]. - Режим доступа: http://www.pwc.com/en_GX/gx/technology/publications/assets/semiconductor-industry-analysis-and-projections.pdf - Дата доступа: 28.02.2013</mixed-citation></citation-alternatives></ref><ref id="cit5"><label>5</label><citation-alternatives><mixed-citation xml:lang="ru">Ando M., Tsukahara H., Oshima Y. Method and apparatus for measuring three-dimensional configuration of wire-shaped object in a short time / U.S. patent № 5243406</mixed-citation><mixed-citation xml:lang="en">Ando M., Tsukahara H., Oshima Y. Method and apparatus for measuring three-dimensional configuration of wire-shaped object in a short time / U.S. patent № 5243406</mixed-citation></citation-alternatives></ref><ref id="cit6"><label>6</label><citation-alternatives><mixed-citation xml:lang="ru">Tomiyama H., Nagai S. Bonding wire detection method / U.S. patent № 5576828.</mixed-citation><mixed-citation xml:lang="en">Tomiyama H., Nagai S. Bonding wire detection method / U.S. patent № 5576828.</mixed-citation></citation-alternatives></ref><ref id="cit7"><label>7</label><citation-alternatives><mixed-citation xml:lang="ru">Hui Cheng X., Hong Leung W. Wire loop height measurement apparatus and method / U.S. patent № 7,145,162</mixed-citation><mixed-citation xml:lang="en">Hui Cheng X., Hong Leung W. Wire loop height measurement apparatus and method / U.S. patent № 7,145,162</mixed-citation></citation-alternatives></ref><ref id="cit8"><label>8</label><citation-alternatives><mixed-citation xml:lang="ru">Dong-Joong K., Jong-Eun H., Mun-Ho J. // International journal of control, automation and systems. 2008. Vol. 6, № 5. Р. 746-754.</mixed-citation><mixed-citation xml:lang="en">Dong-Joong K., Jong-Eun H., Mun-Ho J. // International journal of control, automation and systems. 2008. Vol. 6, № 5. Р. 746-754.</mixed-citation></citation-alternatives></ref></ref-list><fn-group><fn fn-type="conflict"><p>The authors declare that there are no conflicts of interest present.</p></fn></fn-group></back></article>
