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<article article-type="research-article" dtd-version="1.3" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xml:lang="ru"><front><journal-meta><journal-id journal-id-type="publisher-id">bsuir</journal-id><journal-title-group><journal-title xml:lang="ru">Доклады БГУИР</journal-title><trans-title-group xml:lang="en"><trans-title>Doklady BGUIR</trans-title></trans-title-group></journal-title-group><issn pub-type="ppub">1729-7648</issn><issn pub-type="epub">2708-0382</issn><publisher><publisher-name>БГУИР</publisher-name></publisher></journal-meta><article-meta><article-id custom-type="elpub" pub-id-type="custom">bsuir-1120</article-id><article-categories><subj-group subj-group-type="heading"><subject>Research Article</subject></subj-group><subj-group subj-group-type="section-heading" xml:lang="ru"><subject>ЭЛЕКТРОНИКА, РАДИОФИЗИКА, РАДИОТЕХНИКА, ИНФОРМАТИКА</subject></subj-group><subj-group subj-group-type="section-heading" xml:lang="en"><subject>ELECTRONICS, RADIOPHYSICS, RADIOENGINEERING, INFORMATICS</subject></subj-group></article-categories><title-group><article-title>ВЛИЯНИЕ РЕЖИМОВ ФОРМИРОВАНИЯ СИЛИЦИДА ПЛАТИНЫ МЕТОДОМ БЫСТРОЙ ТЕРМООБРАБОТКИ НА ПАРАМЕТРЫ ДИОДОВ ШОТТКИ</article-title><trans-title-group xml:lang="en"><trans-title>The impact of formation modes of platinum silicide by the quick heat treatment on Schottky diodes parameters</trans-title></trans-title-group></title-group><contrib-group><contrib contrib-type="author" corresp="yes"><name-alternatives><name name-style="eastern" xml:lang="ru"><surname>Солодуха</surname><given-names>В. А.</given-names></name><name name-style="western" xml:lang="en"><surname>Saladukha</surname><given-names>V. A.</given-names></name></name-alternatives><bio xml:lang="ru"/><bio xml:lang="en"/><xref ref-type="aff" rid="aff-1"/></contrib><contrib contrib-type="author" corresp="yes"><name-alternatives><name name-style="eastern" xml:lang="ru"><surname>Пилипенко</surname><given-names>В. А.</given-names></name><name name-style="western" xml:lang="en"><surname>Pilipenko</surname><given-names>V. A.</given-names></name></name-alternatives><bio xml:lang="ru"><p>Пилипенко Владимир Александрович - д.т.н., профессор, членкорреспондент НАН Беларуси, заместитель директора по научному развитию ГЦ «Белмикроанализ»</p><p>220108, г. Минск, ул. Казинца, 121А</p><p>тел. +375-17-212-37-41</p></bio><bio xml:lang="en"><p>Pilipenka Uladzimir Aleksandrovich - D.Sci, professor, corresponding member of the National academy of sciences of Belarus, deputy director of science development of state center «Belmicroanalysis»</p><p>220108, Minsk, Kazintsa st., 121A</p><p>tel. +375-17-212-37-41</p></bio><email xlink:type="simple">office@bms.by</email><xref ref-type="aff" rid="aff-1"/></contrib><contrib contrib-type="author" corresp="yes"><name-alternatives><name name-style="eastern" xml:lang="ru"><surname>Горушко</surname><given-names>В. А.</given-names></name><name name-style="western" xml:lang="en"><surname>Gorushko</surname><given-names>V. A.</given-names></name></name-alternatives><bio xml:lang="ru"/><bio xml:lang="en"><p>leading engineer of state center «Belmicroanalysis»</p></bio><xref ref-type="aff" rid="aff-1"/></contrib><contrib contrib-type="author" corresp="yes"><name-alternatives><name name-style="eastern" xml:lang="ru"><surname>Филипеня</surname><given-names>В. А.</given-names></name><name name-style="western" xml:lang="en"><surname>Philipenya</surname><given-names>V. A.</given-names></name></name-alternatives><bio xml:lang="ru"/><bio xml:lang="en"/><xref ref-type="aff" rid="aff-1"/></contrib></contrib-group><aff-alternatives id="aff-1"><aff xml:lang="ru"><institution>Открытое акционерное общество «ИНТЕГРАЛ» − управляющая компания холдинга «ИНТЕГРАЛ»</institution></aff><aff xml:lang="en"><institution>JSC «INTEGRAL» – holding managing company «INTEGRAL»</institution></aff></aff-alternatives><pub-date pub-type="collection"><year>2019</year></pub-date><pub-date pub-type="epub"><day>05</day><month>06</month><year>2019</year></pub-date><volume>0</volume><issue>1</issue><fpage>62</fpage><lpage>67</lpage><permissions><copyright-statement>Copyright &amp;#x00A9; Солодуха В.А., Пилипенко В.А., Горушко В.А., Филипеня В.А., 2019</copyright-statement><copyright-year>2019</copyright-year><copyright-holder xml:lang="ru">Солодуха В.А., Пилипенко В.А., Горушко В.А., Филипеня В.А.</copyright-holder><copyright-holder xml:lang="en">Saladukha V.A., Pilipenko V.A., Gorushko V.A., Philipenya V.A.</copyright-holder><license xml:lang="ru" license-type="creative-commons-attribution" xlink:href="https://creativecommons.org/licenses/by/4.0/" xlink:type="simple"><license-p>Данная работа распространяется под лицензией Creative Commons Attribution 4.0.</license-p></license><license xml:lang="en" license-type="creative-commons-attribution" xlink:href="https://creativecommons.org/licenses/by/4.0/" xlink:type="simple"><license-p>This work is licensed under a Creative Commons Attribution 4.0 License.</license-p></license></permissions><self-uri xlink:href="https://doklady.bsuir.by/jour/article/view/1120">https://doklady.bsuir.by/jour/article/view/1120</self-uri><abstract><p>Приведены результаты исследования влияния режимов формирования силицида платины с применением быстрой термической обработки на электорофизические параметры диодов Шоттки. Показано, что данная обработка, по сравнению с традиционной, позволяет за счет уменьшения микрорельефа границы раздела PtSi–Si, а также получения в результате обработки менее дефектной и равновесной структуры барьерного слоя повысить высоту барьера с 0,804 до 0,825 В, снизить ток утечки с –4,42·10-6 до –2,85·10-6 А и в 1,25 раза повысить надежность диодов Шоттки при температуре эксплуатации 125 °С.</p></abstract><trans-abstract xml:lang="en"><p>The results of studying of the impact of formation modes of platinum silicide using qiuck heat treatment on electrophysical parameters of Schottky diodes are presented. It is shown that this treatment, as compared to the traditional one, allows at the cost of reducing of microrelief of boundary of PtSi–Si, and also obtaining as a result of treatment a less defective and equilibrium structure of the barrier layer, to raise barrier height from 0,804 to 0,825 V, to reduce leakage current from –4,42·10-6 to –2,85·10-6 A and in 1,25 times and to raise the reliability of Schottky diodes at operating temperature 125 °C.</p></trans-abstract><kwd-group xml:lang="ru"><kwd>диод Шоттки</kwd><kwd>быстрая термообработка</kwd><kwd>силицид платины</kwd><kwd>высота барьера</kwd><kwd>ток утечки</kwd></kwd-group><kwd-group xml:lang="en"><kwd>Schottky diode</kwd><kwd>quick heat treatment</kwd><kwd>platinum silicide</kwd><kwd>barrier height</kwd><kwd>leakage current</kwd></kwd-group></article-meta></front><back><ref-list><title>References</title><ref id="cit1"><label>1</label><citation-alternatives><mixed-citation xml:lang="ru">Roderick E.Kh. Metal-semiconductor contacts. М.: Radio and communication, 1982. 216 p.</mixed-citation><mixed-citation xml:lang="en">Roderick E.Kh. Metal-semiconductor contacts. М.: Radio and communication, 1982. 216 p.</mixed-citation></citation-alternatives></ref><ref id="cit2"><label>2</label><citation-alternatives><mixed-citation xml:lang="ru">Strikha V.I., Buzaneva Е.V. Physical basis of the reliability of metal-semiconductor contacts in integrated electronics. М.: Radion and communication, 1987. 256 p.</mixed-citation><mixed-citation xml:lang="en">Strikha V.I., Buzaneva Е.V. Physical basis of the reliability of metal-semiconductor contacts in integrated electronics. М.: Radion and communication, 1987. 256 p.</mixed-citation></citation-alternatives></ref><ref id="cit3"><label>3</label><citation-alternatives><mixed-citation xml:lang="ru">VLSI Technology / Ed. by S.М. Zi. Vol. 2. М.: Мir, 1986. 453 p.</mixed-citation><mixed-citation xml:lang="en">VLSI Technology / Ed. by S.М. Zi. Vol. 2. М.: Мir, 1986. 453 p.</mixed-citation></citation-alternatives></ref><ref id="cit4"><label>4</label><citation-alternatives><mixed-citation xml:lang="ru">Мiurarka Sh.P. Silicides for VLSI. М.: Мir, 1986. 176 p.</mixed-citation><mixed-citation xml:lang="en">Мiurarka Sh.P. Silicides for VLSI. М.: Мir, 1986. 176 p.</mixed-citation></citation-alternatives></ref><ref id="cit5"><label>5</label><citation-alternatives><mixed-citation xml:lang="ru">Low-temperature formation method of contact layer of platinum silicide for high-power Schottky diodes / F.F. Коmarov [et al.] // Reports of Belarus National Academy of Sciences. 2013. Т. 53, No. 2. P. 38–42.</mixed-citation><mixed-citation xml:lang="en">Low-temperature formation method of contact layer of platinum silicide for high-power Schottky diodes / F.F. Коmarov [et al.] // Reports of Belarus National Academy of Sciences. 2013. Т. 53, No. 2. P. 38–42.</mixed-citation></citation-alternatives></ref><ref id="cit6"><label>6</label><citation-alternatives><mixed-citation xml:lang="ru">Two-step low temperature annealing for the Nickel-Platinum compound silicide formation for high-power Schottky diodes / V. Saladukha [et al.] // IX International Conference «Ion Implantation and Other Application of Ions and Electrons». Poland, Kazimierz Dolny, 25–28 June 2012. P. 99–100.</mixed-citation><mixed-citation xml:lang="en">Two-step low temperature annealing for the Nickel-Platinum compound silicide formation for high-power Schottky diodes / V. Saladukha [et al.] // IX International Conference «Ion Implantation and Other Application of Ions and Electrons». Poland, Kazimierz Dolny, 25–28 June 2012. P. 99–100.</mixed-citation></citation-alternatives></ref><ref id="cit7"><label>7</label><citation-alternatives><mixed-citation xml:lang="ru">The formation of silicides by pulse heat treatment of film structures / V.А. Labunov [et al.] // Foreign electronic technique. 1985. No. 8. P. 27–53.</mixed-citation><mixed-citation xml:lang="en">The formation of silicides by pulse heat treatment of film structures / V.А. Labunov [et al.] // Foreign electronic technique. 1985. No. 8. P. 27–53.</mixed-citation></citation-alternatives></ref><ref id="cit8"><label>8</label><citation-alternatives><mixed-citation xml:lang="ru">Pilipenko V.А., Ponomar V.N., Gorushko V.А. Properties controlling of thin-film systems using pulse photon treatment // Engineering-physical journal. 2003. Vol. 76, No. 4. P. 95–98.</mixed-citation><mixed-citation xml:lang="en">Pilipenko V.А., Ponomar V.N., Gorushko V.А. Properties controlling of thin-film systems using pulse photon treatment // Engineering-physical journal. 2003. Vol. 76, No. 4. P. 95–98.</mixed-citation></citation-alternatives></ref><ref id="cit9"><label>9</label><citation-alternatives><mixed-citation xml:lang="ru">Singh R., Nulman J. Development trends in the direction of rapid isothremal processing (RIP) dominated silicon integrated circuit fabrication // Material research society. 1991. P. 441–448.</mixed-citation><mixed-citation xml:lang="en">Singh R., Nulman J. Development trends in the direction of rapid isothremal processing (RIP) dominated silicon integrated circuit fabrication // Material research society. 1991. P. 441–448.</mixed-citation></citation-alternatives></ref><ref id="cit10"><label>10</label><citation-alternatives><mixed-citation xml:lang="ru">Standart 11 050.003-83. Gases used in the manufacture of Electronics Articles. Technical requirements and control methods.</mixed-citation><mixed-citation xml:lang="en">Standart 11 050.003-83. Gases used in the manufacture of Electronics Articles. Technical requirements and control methods.</mixed-citation></citation-alternatives></ref></ref-list><fn-group><fn fn-type="conflict"><p>The authors declare that there are no conflicts of interest present.</p></fn></fn-group></back></article>
