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<article article-type="research-article" dtd-version="1.3" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xml:lang="ru"><front><journal-meta><journal-id journal-id-type="publisher-id">bsuir</journal-id><journal-title-group><journal-title xml:lang="ru">Доклады БГУИР</journal-title><trans-title-group xml:lang="en"><trans-title>Doklady BGUIR</trans-title></trans-title-group></journal-title-group><issn pub-type="ppub">1729-7648</issn><issn pub-type="epub">2708-0382</issn><publisher><publisher-name>БГУИР</publisher-name></publisher></journal-meta><article-meta><article-id custom-type="elpub" pub-id-type="custom">bsuir-1118</article-id><article-categories><subj-group subj-group-type="heading"><subject>Research Article</subject></subj-group><subj-group subj-group-type="section-heading" xml:lang="ru"><subject>ЭЛЕКТРОНИКА, РАДИОФИЗИКА, РАДИОТЕХНИКА, ИНФОРМАТИКА</subject></subj-group><subj-group subj-group-type="section-heading" xml:lang="en"><subject>ELECTRONICS, RADIOPHYSICS, RADIOENGINEERING, INFORMATICS</subject></subj-group></article-categories><title-group><article-title>ИССЛЕДОВАНИЕ РАСПРОСТРАНЕНИЯ ТЕПЛА В ПЛАТЕ ИЗ АЛЮМИНИЯ С НАНОПОРИСТЫМ АНОДНЫМ ОКСИДОМ АЛЮМИНИЯ ТЕПЛОВИЗИОННЫМ МЕТОДОМ</article-title><trans-title-group xml:lang="en"><trans-title>Study of distribution of thermal fluxes in a plate of aluminum with nanoporous aluminum oxide by means of thermal imaging measurements</trans-title></trans-title-group></title-group><contrib-group><contrib contrib-type="author" corresp="yes"><name-alternatives><name name-style="eastern" xml:lang="ru"><surname>Динь</surname><given-names>Х. Т.</given-names></name><name name-style="western" xml:lang="en"><surname>Dinh</surname><given-names>H. T.</given-names></name></name-alternatives><bio xml:lang="ru"/><bio xml:lang="en"/><xref ref-type="aff" rid="aff-1"/></contrib><contrib contrib-type="author" corresp="yes"><name-alternatives><name name-style="eastern" xml:lang="ru"><surname>Лушпа</surname><given-names>Н. В.</given-names></name><name name-style="western" xml:lang="en"><surname>Lushpa</surname><given-names>N. V.</given-names></name></name-alternatives><bio xml:lang="ru"><p>Лушпа Никита Васильевич - магистрант кафедры микро- и наноэлектроники</p><p>220013, г. Минск, ул. П. Бровки, 6</p><p>тел. +375-29-349-07-00</p></bio><bio xml:lang="en"><p>Lushpa Nikita Vasil'evich - master student of micro- and nanoelectronics department</p><p>220013, Minsk. P. Brovki st., 6</p><p>tel. +375-29-349-07-00</p></bio><email xlink:type="simple">nikita.95_@mail.ru</email><xref ref-type="aff" rid="aff-1"/></contrib><contrib contrib-type="author" corresp="yes"><name-alternatives><name name-style="eastern" xml:lang="ru"><surname>Чернякова</surname><given-names>Е. В.</given-names></name><name name-style="western" xml:lang="en"><surname>Chernyakova</surname><given-names>K. V.</given-names></name></name-alternatives><bio xml:lang="ru"/><bio xml:lang="en"/><xref ref-type="aff" rid="aff-1"/></contrib><contrib contrib-type="author" corresp="yes"><name-alternatives><name name-style="eastern" xml:lang="ru"><surname>Врублевский</surname><given-names>И. А.</given-names></name><name name-style="western" xml:lang="en"><surname>Vrublevsky</surname><given-names>I. A.</given-names></name></name-alternatives><bio xml:lang="ru"/><bio xml:lang="en"/><xref ref-type="aff" rid="aff-1"/></contrib></contrib-group><aff-alternatives id="aff-1"><aff xml:lang="ru"><institution>Белорусский государственный университет информатики и радиоэлектроники</institution></aff><aff xml:lang="en"><institution>Belarusian state university of informatics and radioelectronics</institution></aff></aff-alternatives><pub-date pub-type="collection"><year>2019</year></pub-date><pub-date pub-type="epub"><day>05</day><month>06</month><year>2019</year></pub-date><volume>0</volume><issue>1</issue><fpage>45</fpage><lpage>50</lpage><permissions><copyright-statement>Copyright &amp;#x00A9; Динь Х.Т., Лушпа Н.В., Чернякова Е.В., Врублевский И.А., 2019</copyright-statement><copyright-year>2019</copyright-year><copyright-holder xml:lang="ru">Динь Х.Т., Лушпа Н.В., Чернякова Е.В., Врублевский И.А.</copyright-holder><copyright-holder xml:lang="en">Dinh H.T., Lushpa N.V., Chernyakova K.V., Vrublevsky I.A.</copyright-holder><license xml:lang="ru" license-type="creative-commons-attribution" xlink:href="https://creativecommons.org/licenses/by/4.0/" xlink:type="simple"><license-p>Данная работа распространяется под лицензией Creative Commons Attribution 4.0.</license-p></license><license xml:lang="en" license-type="creative-commons-attribution" xlink:href="https://creativecommons.org/licenses/by/4.0/" xlink:type="simple"><license-p>This work is licensed under a Creative Commons Attribution 4.0 License.</license-p></license></permissions><self-uri xlink:href="https://doklady.bsuir.by/jour/article/view/1118">https://doklady.bsuir.by/jour/article/view/1118</self-uri><abstract><p>В работе представлены результаты исследований тепловых потоков в плате из алюминия с нанопористым оксидом алюминия, генерируемых линейным источником теплоты. Показано, что распространение тепла в направлении, перпендикулярном длине источника, имеет форму конуса тепловой трубы с началом от источника нагрева на поверхности и характеризуется расширением по направлению к нижней стороне платы из алюминия. Такая форма распространения тепла позволяет снизить тепловое сопротивление платы.</p></abstract><trans-abstract xml:lang="en"><p>The paper presents the results of studies of heat fluxes in a printed circuit board made of aluminum with nanoporous anodic alumina, generated by linear heat source. It is established that in this case the shape of the cone of the heat pipe with the beginning from a point heating source on the surface was characterized by expansion towards the back side of the aluminum base. This effect leads to a decrease in the thermal resistance of the printed circuit board.</p></trans-abstract><kwd-group xml:lang="ru"><kwd>печатная плата из алюминия</kwd><kwd>нанопористый оксид алюминия</kwd><kwd>тепловой поток</kwd><kwd>конус тепловой трубки</kwd><kwd>углеродная нить</kwd><kwd>линейный источник теплоты</kwd></kwd-group><kwd-group xml:lang="en"><kwd>aluminum printed circuit board</kwd><kwd>nanoporous alumina</kwd><kwd>heat flow</kwd><kwd>cone of the heat pipe</kwd><kwd>carbon filament</kwd><kwd>linear source of heat</kwd></kwd-group><funding-group><funding-statement xml:lang="ru">Работа выполнена при поддержке белорусско-сербского проекта № Ф18СРБГ-003.</funding-statement></funding-group></article-meta></front><back><ref-list><title>References</title><ref id="cit1"><label>1</label><citation-alternatives><mixed-citation xml:lang="ru">Теплопроводящие платы на основе алюминия с наноструктурированным слоем Al2O3 для изделий силовой электроники / Е. 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